Copper-based alloy lead frames currently account for over 90 per cent of the market. Among these, the C194 copper alloy offers outstanding value for money, combining electrical conductivity, thermal conductivity and mechanical strength, and is suitable for the vast majority of consumer electronics, industrial and conventional automotive electronic products. Iron-nickel alloys, whilst offering a coefficient of thermal expansion that is better matched to silicon chips, are primarily used in high-reliability military and aerospace products; however, due to their relatively poor electrical conductivity and higher cost, their market share continues to decline.

Electroplating of product surfaces (nickel plating, silver plating) is a critical stage in the production process, directly affecting bonding stability and resistance to oxidation.