Through-hole DIP and TO series: compatible with lead frames for discrete components such as 220, 92 and 126;

Surface-mount SOT-23, SOP8, SOP16: standard package types for general-purpose integrated circuits;

QFN/DFN ultra-thin packages: high-density etched lead frames;

New energy power devices, MOSFETs, diodes and transistors all require lead frames of the appropriate specifications for packaging and moulding; with product specifications and models numbering in the hundreds, the range of products a company stocks is a key threshold for meeting customer requirements.