Stamping process: This method relies on high-speed forming using precision dies, offering high production efficiency and moderate unit manufacturing costs. It is suitable for high-volume products with relatively wide pin pitches and conventional structures (such as DIP, SOT and TO220), and represents a mature production route with a higher market share in the industry; the core production capacity of most domestic manufacturers is centred on stamping production lines.

Etching process: Utilising photolithography and chemical etching to form the structure, this process offers higher precision in line width and spacing, as well as finer features. It is suitable for fine-pitch, high-density, high-end packages (QFN, DFN) and meets the miniaturisation requirements of 5G and automotive-grade chips. Whilst it requires a higher overall investment in equipment and processes, it represents a high-end upgrade direction for the industry.

Industry consensus: Stamping solutions are commonly used for small- and medium-pin-count, standard-power devices; whilst multi-pin, high-precision, high-end packages are gradually shifting towards etching solutions.