The lead frame serves as the core carrier in semiconductor packaging. It uses bonding materials such as gold wire and copper wire to connect the internal circuits of the chip to the external leads, fulfilling three fundamental functions: mechanical support, electrical conductivity and heat dissipation. Approximately 70 per cent of the heat generated by the chip is dissipated through the lead frame; the dimensional accuracy, flatness and corrosion resistance of the product directly determine the packaging yield and the long-term reliability of the chip.

In terms of industry classification, the sector is divided into two main categories: integrated circuit lead frames (suitable for SOP, DIP, SOT, QFN, SOP16 and other package types) and discrete power device lead frames (suitable for TO, IPAK, 220 series and other package types); these also correspond to the product categories in which Longteng Electronics specialises.